Characterization, Packaging, & Test

Characterization, packaging and testing tools support a variety of techniques and measurements essential for controlling fabrication processes and final device performance.

Bruker Dimension Icon AFM

The Bruker Dimension Icon AFM (Atomic Force Microscope) is a very high resolution scanning microscope used in scanning microscopy (SPM) which produces three dimensional images. It is used for nanoscale surface topography, nano-mechanical, nano-electircal, and nano-scale chemical mapping, and morphology measurement.

Despatch LCC1-15-5 Resist Oven

The Despatch LCC1 Resist Oven are used in die-curing and other semiconductor packing processes. The ovens are configured for 50/60 Hz.

Disco DAD3240 Automatic Dicing Saw

The Disco DAD3240 Dicing Saw is a compact, manual, precision dicing saw with an automatic function which is common to the DAD3000 series. Its operating system and LCD touch panel allow for intuitive handling and it can cut through a range of materials, including difficult-to-cut materials essential to the nanofabrication process such as silicon.

Filmetrics F3 Film Thickness Spectral Reflectometer

The Filmetrics F3 Film Thickness Spectral Reflectometer is most commonly used to measure thin-film properties by adding thickness and refractive index software modules. The thickness and reactiveness can be measured in less than 3 seconds.

Fisher Scientific Isotemp FMS Refrigerator

The Fisher Scientific Isotemp FMS Refrigerator is use for safe storage of volatile materials, pharmaceuticals, clinical reagents, and biological samples.

Fisher Scientific Revco FMS Freezer

The Fisher Scientific Revco FMS Freezer is used for medical and scientific applications such as storage of reagents, pharmaceuticals, biologicals or other commonly used laboratory materials.

FMS Thin Film Stress Measurement System

The FMS Thin Film Stress Measurement System is used to test the stress of different films and substrates. It can also test the coefficient of thermal expansion (CTE) of films.

Horiba UVISEL 2 Spectroscopic Ellipsometer

The UVISEL 2 is an accurate and sensitive ellipsometer and includes a wide range of integrated automated features useful for the investigation of all materials. The UVISEL 2 is simple to operate and has the performance required for characterizing all current materials as well as the next generation of materials and structures.

K&S 4129 Wedge Bonder

The K&S 4129 Wedge Bonder is an aluminum and gold wire wedge bonder that is used for binding devices.

Keysight B1500A Semiconductor Device Analyzer

The Keysight B1500A Semiconductor Device Analyzer provides a wide range of measurement capabilities to cover the electrical characterization and evaluation of devices, materials, semiconductors, active/passive components, or virtually any other type of electronic device with uncompromised measurement reliability and efficiency.

KLA-Tencor P-7 Surface Profilometer

The KLA-Tencor P-7 Surface Profilometer is a research grade stylus profiler for surface metrology and measurement. The KLA-Tencor P-7 is software equipped with parameters for a wide range of measurements including depth, step height, roughness, waviness, slop, flatness, distance, bearing ratio, radius of curvature, and more.

MiniPack Torre MVS-45X Vacuum Sealer

The Minipack MVS 45X chamber sealer is an industrial-level vacuum sealer designed to packaging products. The large 18.5" x 16" x 4.5" chamber allows plenty of room for packaging a variety of products. The basin is seamless, making it easy to clean.

Nikon Eclipse L200 Microscope

The Nikon Eclipse L200 Optical Microscope is a microscope capable of greater contrast, high resolving power and darkfield images up to three times brighter than other models. It can be used for the precise optical inspection of wafers, photo masks, reticles and other substrates.

Questar Q7800 Automatic Wedge Bonder

The Questar Q7800 Automatic Wedge Bonder is used for connecting wires in chips, sensors, and such.

Signatone Checkmate CM21X Probe Station

The Signatone CheckMate Probe Station is an ultra-stable 200mm / 300mm analytical probe station with coarse and fine wafer stage movement to provide fast wafer movement as well as submicron resolution.

Ultron UH104 UV Curing System

The Ultron UH104 UV Curing System is used to toughen and strengthen polymer materials by cross-linking polymer chains. It accommodates up to 8" (200mm) wafers on film frames or grip rings and up to 12" (300mm) wafer capability.

Ultron UH114 Wafer/Frame Film Applicator

The Ultron UH114 Wafer/Frame Film Applicator is used in the process of slicing/ sawing applications in which lamination is crucial. This device ensures a bubble free lamination with adjustable features.