Overview
The Ultron UH114 Wafer/Frame Film Applicator is used in the process of slicing/ sawing applications in which lamination is crucial. This device ensures a bubble free lamination with adjustable features.
Ultron UH114 Wafer/Frame Film Applicator
Key Features
Circular cutter (wheel-type) for cutting film on film frame
Adjustable cutting pressure for different films
Digital temperature controlled platen
Adjustable work stage height from top of unit
Accommodates wafer up to 6" capability