Pritzker Nanofab at UChicago

The Bruker Dimension Icon AFM (Atomic Force Microscope) is a very high resolution scanning microscope used in scanning microscopy (SPM) which produces three dimensional images. It is used for nanoscale surface topography, nano-mechanical, nano-electircal, and nano-scale chemical mapping, and morphology measurement.

The Despatch LCC1 Resist Oven are used in die-curing and other semiconductor packing processes. The ovens are configured for 50/60 Hz.

The Disco DAD3240 Dicing Saw is a compact, manual, precision dicing saw with an automatic function which is common to the DAD3000 series. Its operating system and LCD touch panel allow for intuitive handling and it can cut through a range of materials, including difficult-to-cut materials essential to the nanofabrication process such as silicon.

The FEI Quanta 650 FEG SEM (Scanning Electron Microscope) is a variable pressure microscope used for high resolution imaging. It is capable of resolving features on a scale of less than 5 nm. It is equipped with a Field Emission Gun (FEG) which allows for bright-field and dark-field sample imaging. The SEM is equipped with a total of 8 detectors for the purpose of imaging and analysis as well as a Nabity Nanometer Pattern Generation System (NPGS) which allows for advanced electron beam lithography by means of the SEM.

The Filmetrics F3 Film Thickness Spectral Reflectometer is most commonly used to measure thin-film properties by adding thickness and refractive index software modules. The thickness and reactiveness can be measured in less than 3 seconds.

The Fisher Scientific Isotemp FMS Refrigerator is use for safe storage of volatile materials, pharmaceuticals, clinical reagents, and biological samples.

The Fisher Scientific Revco FMS Freezer is used for medical and scientific applications such as storage of reagents, pharmaceuticals, biologicals or other commonly used laboratory materials.

The FMS Thin Film Stress Measurement System is used to test the stress of different films and substrates. It can also test the coefficient of thermal expansion (CTE) of films.

The K&S 4129 Wedge Bonder is an aluminum and gold wire wedge bonder that is used for binding devices.

The Keysight B1500A Semiconductor Device Analyzer provides a wide range of measurement capabilities to cover the electrical characterization and evaluation of devices, materials, semiconductors, active/passive components, or virtually any other type of electronic device with uncompromised measurement reliability and efficiency.

The Zeta-20 is a fully integrated optical profiling microscope that provides 3D metrology and imaging capability. Available measurement techniques include confocal microscopy, vertical scanning interferometry (white light), phase shifting interferometry, thin film reflectometry, and differential interference contrast imaging. The software allows sample mapping, image stitching, and automated feature detection. Objective lenses up to 50x allow measurement of small features.

The KLA-Tencor P-7 Surface Profilometer is a research grade stylus profiler for surface metrology and measurement. The KLA-Tencor P-7 is software equipped with parameters for a wide range of measurements including depth, step height, roughness, waviness, slop, flatness, distance, bearing ratio, radius of curvature, and more.

The Minipack MVS 45X chamber sealer is an industrial-level vacuum sealer designed to packaging products. The large 18.5" x 16" x 4.5" chamber allows plenty of room for packaging a variety of products. The basin is seamless, making it easy to clean.

The Nikon Eclipse L200 Optical Microscope is a microscope capable of greater contrast, high resolving power and darkfield images up to three times brighter than other models. It can be used for the precise optical inspection of wafers, photo masks, reticles and other substrates.

The Questar Q7800 Automatic Wedge Bonder is used for connecting wires in chips, sensors, and such.

The Signatone CheckMate Probe Station is an ultra-stable 200mm / 300mm analytical probe station with coarse and fine wafer stage movement to provide fast wafer movement as well as submicron resolution.

The Ultron UH104 UV Curing System is used to toughen and strengthen polymer materials by cross-linking polymer chains. It accommodates up to 8" (200mm) wafers on film frames or grip rings and up to 12" (300mm) wafer capability.

The Ultron UH114 Wafer/Frame Film Applicator is used in the process of slicing/ sawing applications in which lamination is crucial. This device ensures a bubble free lamination with adjustable features.