Overview
The FMS Thin Film Stress Measurement System is used to test the stress of different films and substrates. It can also test the coefficient of thermal expansion (CTE) of films.
FMS Thin Film Stress Measurement System
Key Features
Dual laser wavelength to avoid destructive interference from dielectric in film
Wafer range of 2-8in diameter
3D map capabilities
Temperature range from room temp to 500 Celsius