AZ nLOF 2070 Photoresist
Overview
The AZ nLOF 2020 Photoresist is an i-line photoresist designed to simplify complex lift-off lithography processes. The nLOF 2070 Photoresist works well in both surfactant and non-surfactant containing tetramethylammonium hydroxide (TMAH) developers.
Features
- Streamlined lift-off process
- Film thickness of 7.0 μm at 3000 rpm
- Process capability of 1.5 μm CD
- Photospeed of 180 mJ / cm2
- E-Beam sensitive
- Compatible with AZ 726 MIF Developer
Hazards
- Flammable liquid and vapour
- Serious eye irritation
- May cause respiratory irritation, drowsiness, dizziness
Safety
- Keep away from heat, sparks, open flames and hot surfaces
- Take precautionary measures against static discharge
- Wear chemical resistant eye protection, protective gloves and clothing
General Documentation
Storage and Waste
- Storage: FLAM 1
- Waste: SOL 1 & 2, PR 1 & 2
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