AZ nLOF 2020 Photoresist

Overview

The AZ nLOF 2020 Photoresist is an i-line photoresist designed to simplify complex lift-off lithography processes. The nLOF 2020 Photoresist works well in both surfactant and non-surfactant containing tetramethylammonium hydroxide (TMAH) developers.

Features

Streamlined lift-off process
Film thickness of 2.0 μm at 3000 rpm
Process capability of 0.7 μm CD
Photospeed of 66 mJ / cm²
Compatible with AZ 300 MIF Developer, AZ 400T Stripper

Hazards

Flammable liquid and vapour
Serious eye irritation
May cause respiratory irritation, drowsiness, dizziness

Safety

Keep away from heat, sparks, open flames and hot surfaces
Take precautionary measures against static discharge
Wear chemical resistant eye protection, protective gloves and clothing

General Documentation

Storage and Waste

Storage: FLAM 1
Waste: SOL 1 & 2, PR 1 & 2

Related Equipment

WAFAB Developer Bench