Overview
The AZ MiR 703 Positive Photoresist is a medium resolution i-line sensitive Photoresist optimized for line and contact hole pattern layers.
AZ MiR 703 Positive Photoresist
Features
- Coated thickness range of 0.75 - 2.0 µm
- Can be used in dry and wet etch process environments
- Compatible with g-line, i-line, or broadband exposure tools
- Good for line/space and contact hole patterns
- Compatible with developers AZ 300MIF and AZ 726MIF
Hazards
- Flammable liquid and vapour
- Eye irritation
- Respiratory irritation
Safety
- Avoid contact with eyes, skin, and clothing
- Use adequate ventilation and avoid breathing in fumes
- Wear chemical resistant eye protection, protective gloves and clothing
- Keep away from open flames, sparks, heat, and hot surfaces
General Documentation
Storage and Waste
- FLAM 1
- SOL 1 & 2, PR 1 & 2
Related Equipment
- WAFAB Developer Bench