Overview
The AZ 1518 Photoresist is a Photoresist of elevated film thickness used for improved stability resist masks in wet etching processes.
AZ 1518 Photoresist
Features
- Resist film thickness of approximately 1.8 μm
- Depending on spin speed thickness of 1.5 μm - 3 μm can be achieved
- Excellent for wet etch processes
- g- , h- , and i-line sensitive at 320 - 440 nm
- Compatible with developers -
- Compatible with strippers -
Hazards
- Flammable liquid and vapour
- Eye irritation
- Respiratory irritation
Safety
- Avoid contact with eyes, skin, and clothing
- Use adequate ventilation and avoid breathing in fumes
- Wear chemical resistant eye protection, protective gloves and clothing
- Keep away from open flames, sparks, heat, and hot surfaces
General Documentation
Storage and Waste
- FLAM 1
- SOL 1 & 2, PR 1 & 2