Lithography
State-of-the-art equipment for processes involving photolithography (to 500nm), electron beam lithography (to 8nm), and direct-write lithography (to 1um). Resist thickness from 20nm to 100um support processes from superconducting to microfluidics.
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I-Line Stepper
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Contact Aligner
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Electron Beam Pattern Generator
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UV Flood Exposure System
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Dual Wavelength Direct Write System (375 nm, 405 nm)