Dry Etching
From state of the art Bosch Process to high temperature Cl2 etch, the PNF has the capability to etch all of the common compound semiconductors and metals. Mems processes can also utilize our HF and XeF2 etchers for release processes.
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ICP III-V and metal etch
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ICP Fluorine Etch
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Bosch Process DRIE
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XeF2 Etcher
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Plasma Asher
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Downstream Asher/etcher
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HF Vapor Etcher
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Critical Point Dryer
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UV Ozone
- AZ MiR 703 Positive Photoresist
The AZ MiR 703 Positive Photoresist is a medium resolution i-line sensitive Photoresist optimized for line and contact hole pattern layers.