YES G1000 Plasma Cleaning System
Overview
The YES G1000 Plasma Cleaning System is a plasma cleaning system used for the cleaning and low temperature descum of substrates, as well the surface modification and gentle cleaning of inorganic substrates. The use of plasma at a low generation frequency (40 kHz) in substrate cleaning allows for flexibility around cleaning processes, including, for example, the cleaning of electronically sensitive devices. The YES G1000 generates plasma between an active and grounded electrode plate, free electrons, created in the plasma field, are drawn down by the grounded plate allowing only active ions to pass through to clean components; the result is uniform and consistent processing which, as highlighted previously, leaves the electronic properties of cleaned components unchanged.
Key Features
- 4 powered shelves for greater capacity over the YES 500 model
5 plasma modes
- Electron free / Downstream mode; used for the cleaning of electronically sensitive devices
- Active mode; used for etching and surface modification prior to bonding
- RIE mode; used for aggressive plasma based surface modification
- Active Ion trap; aggressive plasma based mode for reactive processes
- Downstream Ion trap; used for aggressive, electron free cleaning
- 1/2" 6061-T6 aluminum chamber
- Large load capacity - 15.13" W x 15.39" D process area per tray
- Variable Frequency Matching (VFM)
- Touch Screen Interface
- Unique `downstream' protective design - totally charge-free plasma
- State logic control of output with input monitoring
Key Applications
- Substrate cleaning
- Substrate descum
- Surface modification of inorganic substrates
- Gentle cleaning of inorganic substrates
- Cleaning of electronically sensitive devices
General Documentation
- Related Equipment Categories
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