YES CV200 RFS Plasma Strip / Descum System
Overview
The YES CV200 RFS Plasma Strip / Descum System is used for the removal of thick layers of photoresist or polymide in short production times; accomodating the strict requirements of contemporary front-end semiconductor processing equipment. The YES CV200 RFS operates in two main modes, a powerful plasma stripping mode removes tough and / or thick resists while a gentler descum mode can be used to deal with the cleaning of inorganic substrates.
Key Features
- Quick resist removal, up to 7000 angstroms per minute
- Unique `downstream' protective design - balance of the charge in the plasma shields your product from damaging UV exposure
- Wafers from 50 mm to 200 mm
- Variable Power Supply from 150 W to 1250 W
- Real-time wafer temperature measurement and flexible temperature control
- Multiple process gas inputs
Key Applications
- Photoresist removal
- Polyimide removal
- Organics removal
- Descum processes
General Documentation
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