Plasma-Therm Vision 310 PECVD


The Plasma-Therm Vision 310 PECVD (Plasma Enhanced Chemical Vapor Deposition) system is a CVD system which utilizes plasma to significantly lower the temperatures at which a given film is deposited on a substrate. The Vision 310 can be used for the controlled deposition of SiNx, SiC, a-Si, and SiOxNy films, among others.

Key Features

Key Applications

General Documentation