Plasma-Therm ICP Fluorine Etch

Overview

The Plasma-Therm ICP (Inductively Coupled Plasma) Fluorine Etch is an etching system which uses fluorine solutions to etch metal films and compound semiconductors. Fluorine plasma etching differs from Chlorine etching (see Plasma-Therm ICP Chlorine Etch) in respect of the chemistries used in each. 

Key Features

Key Applications