The Memsstar Orbis Alpha Oxide Etch System is a small footprint, self-contained oxide etch system which utilizes hydrogen fluoride etchants along with memsstar’s unique patented high volume production process to enable researchers to develop production-capable processes for the next generation of MEMS devices.
Large process window to optimize process for any structure
Excellent selectivity with silicon nitride and silicon dioxide (< 5% 1 σ)
High selectivity to underlayer and mechanical materials
Excellent uniformity (< 5% 1 σ) and repeatability (< 5% 1 σ)
Unique endpoint capability
Handles materials from sample sizes to 200 mm
Small footprint (600 x 540 x 900 mm)
PC controlled
Resistive touch screen
RF MEMS
Sensors
RF switches
Temperature gauges