The Heidelberg Direct Write Lithography system is a flexible, high resolution pattern generator for direct writing. The MLA150 creates the design and exposes it directly onto a wafer, no photomask is necessary. The system features environmental control, temperature stabilization, backside alignment, and a 150 x 150 mm2 exposure area.
Minimum feature size down to 1 µm
Non-contact exposure
Substrates up to 8” x 8”, maximum exposure area: 6” x 6”
Light source at 405nm and 375nm
Exposure time at maximum write speed is 9 minutes for 100 x 100 mm2 and 16 minutes for 150 x 150 mm2
Alignment accuracy of 500nm
Multiple data input formats
Fast patterning of masks and wafers in Life Science, MEMS, Micro-Optics, Semiconductor, Sensors, Actuators, MOEMS, Material Research, Nano-Tubes, Graphene
Process Manager
+1 (773) 834-7564
Reserve this tool with the Online Tool Manager.
Tier 0
