The Angstrom Nexdep Thermal E-Beam Evaporator is a PVD tool that offers E-Beam and Thermal evaporation for a variety of high melting point substrates. Nexdep 1 can do principal E-Beam and thermal evaporation. Nexdep 2 can do prinicipal E-Beam, thermal evaporation, and ion assisted deposition.
6 x 7 cc multi-pocket E-Beam
16" × 16" × 28" High aluminum high vacuum box chamber
Additional height for e‐beam evaporation
One set removable stainless steel debris shields
Hinged chamber front door for easy internal access
Base pressure of < 5 x 10-7 Torr in a clean system
Large viewport offset to reduce material deposition
3 kW power supply
Sweep controller
Dual resistive evaporation sources
PC control station with fully automated sequences and software for deposition control
Combined co-deposition processing with e-beam & thermal or thermal & thermal processing (not e-beam & e-beam processing)
Multi-layer deposition control
Nexdep I is configured for Ti, SiO2, Cr, Au, Pt, and Ag
Electronic and Optical Semiconductor films
Wear resistant and thermal barrier coatings
Hard coatings for tools
Tier 0
