The AJA ATC 2200 Sputtering System is a PVD tool which deposits films on a substrate by a method known as sputtering. Magnetron sputtering uses accelerated, positively charged ions from a plasma source to deposit films with an increased deposition rate and more controlled electron bombardment than evident in other sputtering systems (such as diode sputtering).
330-XP (UHV) magnetron sputtering sources in con-focal orientation
Pneumatic source shutters
Integral gas injection to source head for reactive sputtering and low pressure operation
In-situ tilt gimbals with locking UHV position indicator. Allows source head angle adjustment without breaking vacuum
6” CF viewports
Substrates to 6”
Radiant heating to 800 C with quartz halogen lamps
DC and RF generators
Kaufman KDC 40 4cm Gridded Ion Source
Phase II-J Computer Control System
Corrosion resistant coatings
Low friction coatings
Hard, wear resistant coatings
Coatings with specific electrical and optical properties
Process Manager
+1 (773) 834-4978
Reserve this tool with the Online Tool Manager.
Tier 0
