This is a list of the chemicals currently on-site and being used in the PNF. Please click on a specific chemical to be linked to the Safety Data Sheet (SDS).
- 2-Propanol, Isopropyl Alcohol
- 5% Hydrogen in Nitrogen
- 5% Silane in Helium
- Acetic Acid
- Acetone
- Aluminum Etchant Type A
- Aluminum Etchant Type D
- Aluminum
- Ammonia
- Ammonium Hydroxide
- Amyl Acetate
- Anisole
- Argon
- AR-P 6200
- AR-PC 5090
- AZ 300 MIF Developer
- AZ 300T Stripper
- AZ 400K Developer
- AZ 1512 Photoresist
- AZ 726 MIF Developer
- AZ 1518 Photoresist 917MIF
- AZ 5214-E IR Photoresist
- AZ Aquatar-VIII-A 45
- AZ Developer 1:1
- AZ EBR Solvent
- AZ MIR 703 Resist 14cPs
- AZ MIR 703 Photoresist 19cPs
- AZ MIR 703 Photoresist 25cPs
- AZ nLOF 2020 Photoresist
- AZ nLOF 2070 Photoresist
- AZ nLOF 5510 Photoresist
- AZ NMP Rinse
- AZ P4110 Photoresist
- AZ P4210 Photoresist
- AZ P4330 RS Photoresist
- AZ P4620 Photoresist
- AZ(R) 1512 Photoresist
- Bis(tert-butylimino)bis(dimethylamino)tungsten (VI) (BTBMW)
- Buffered Oxide Etchant (BOE)
- Boron Trichloride
- Buffer HF Improved
- Calcium Gluconate
- Chloramine-T Trihydrate
- Chlorine
- Chrome Etch 1020AC
- Chromium Mask Etchant CE-5M
- Citric Acid (Granular)
- Colloidal Silver
- Conductive Graphite in Water
- Copper Etchant CE-100, CE-200
- Cyclopentanone
- Dichlorosilane
- Dow Corning(r) XR-1541-002 E-Beam Resist in MIBK
- Dragersensors
- Ethanol, CDA 19
- Formic Acid
- FOX 16 Flowable Oxide
- Gold Etchant Type TFA
- Gold Metal Pieces
- Halocarbon 14
- Halocarbon 23
- Halocarbon C318
- Helium
- Hexamethyl Disilazane (HMDS)
- Hydrochloric Acid
- Hydrofluoric Acid, 49%
- Hydrogen
- Hydrogen Bromide
- Hydrogen Peroxide, 30%
- KMPR
- Megaposit MF -26A Developer
- Megaposit™ SPR™ 220-7.0 Positive Photoresist
- Megaposit™ SPR™ 955CM-1.4 Positive Photoresist
- Mercury Vapor Lamps
- Methane
- Methanol
- Methyl Ethyl Ketone
- MIBK
- Microposit™ 351 Developer
- Microposit™ LOL™ 2000 Lift Off Layer
- Microposit™ MF™ -321 Developer
- Microposit™ Remover 1165
- Microposit™ S1805™ G2 Positive Photoresist
- Microposit™ S1811™ Positive Photoresist
- Microposit™ S1813™ Photoresist
- MicroPrime HP Primer (MPHP)
- Molybdenum Metal Pieces
- Nano-Strip, Nano-Strip HP
- Nickelex
- Niobium Metal Pieces
- Nitric Acid, 65-70%
- Nitrous Oxide
- O-Phospho Acid
- Oxygen
- Platinum Pieces
- Potassium Hydroxide Pellets
- Potassium Hydroxide Solution, 45%
- Propylene Glycol Monomethyl Ether Acetate/PM Acetate (PGMEA)
- Silane
- Silver Pieces
- Sodium Hydroxide Pellets
- Sodium Hydroxide Solution, 50%
- SU-8 Developer
- SU-8 2000 Series
- SU-8 3000 Series
- Sulfamic Acid
- Sulfur Hexafluoride
- Sulfuric Acid
- Tetrakis(diethylamino)titanium (IV) (TMAT)
- Tetrachlorosilane
- Tetramethylammonium Hydroxide, 25% (TMAH)
- Titanium Metal Pieces
- Toluene
- Trimethylaluminum (TMA)
- Tris(diethylamido)(tert-butylimido)niobium(V) (TBTDEN)
- Tungsten Metal Pieces
- Xylenes