Tystar Mini-Tytan 4600 Furnace System
Overview
The Tystar Mini-Tytan 4600 Furnace system is designed for diffusion, oxidation, and LPCVD applications. The system consists of four vacuum tubes in one furnace stack. Two of these are atmospheric pressure tubes and the other two are low-pressure tubes. The Tystar 4600 can perform low-temperature oxide processes and the deposition of materials such as silicon nitride and polysilicon. The Tystar 4600 offers high process uniformity and incorporates some of the most advanced concepts in high-performance wafer processing. LPCVD PROCESSING IS NOT CURRENTLY AVAILABLE.
Key Features
Wafers up to 6" / I50 mm
Temperatures up to 850 °C for silicon nitride and up to 650 °C for all others
Silicon nitride and polysilicon deposition
Maximum deposition thickness of 5 μm
LTO (Low Temperature Oxidation) for processes of < 450 °C
MFS-460 Mass Flow System
DCS-30 Data Collection System
Key Applications
Suspended membrane fabrication
Silicon conductors
Silicon gate devices
MEMS
Inter level metal isolation
Optical waveguides
Dielectrics
LTO (Low Temperature Oxidation)
R & D
General Documentation
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