The Plasma-Therm Vision 310 PECVD (Plasma Enhanced Chemical Vapor Deposition) system is a CVD system which utilizes plasma to significantly lower the temperatures at which a given film is deposited on a substrate. The Vision 310 can be used for the controlled deposition of SiNx, SiC, a-Si, and SiOxNy films, among others.
Patented dual frequency generator with 300 W at 13.56 MHz / 500 W at 187 kHz
305 mm substrate plate
Temperature control from 30 °C to 300 °C
High temperature electrode up to 380 °C
Optimized shower head for uniform deposition
Digital mass flow controllers with bypass and flush capabilities and up and downstream isolation valves
Semiconductor fabrication
R & D production and application
Stress controlled silicon nitride and silicon dioxide film deposition
MEMS