The Angstrom Nexdep Thermal E-Beam Evaporator is a PVD tool that offers E-Beam and Thermal evaporation for a variety of high melting point substrates. The NexDep can be configured for a variety of PVD processes including resistive thermal evaporation, sputter and ion assisted deposition, and principal E-Beam and Thermal evaporation capacities.
4 x 22 cc multi-pocket E-Beam
16" × 16" × 28" High aluminum high vacuum box chamber
Additional height for e‐beam evaporation
Glass bead blast finish on chamber surfaces
One set removable stainless steel debris shields
Hinged chamber front door for easy internal access
Base pressure of < 5 x 10-7 Torr in a clean system
Large viewport offset to reduce material deposition
3 kW power supply
Sweep controller
Single resistive evaporation source
PC control station with fully automated sequences and software for deposition control
Combined co-deposition processing
Multi-layer deposition control
Configured for AI / AU / CR / NI / Ti / Pt
Electronic and Optical Semiconductor films
Wear resistant and thermal barrier coatings
Hard coatings for tools
Process Manager
+1 (773) 834-4978
Reserve this tool with the Online Tool Manager.
Tier 0
