Physical Vapor Deposition

A modern, flexible toolset in deposition allows for almost any type of film to be deposited from metallic films to dielectric films. Film properties (electrical or mechanical) can be tailored to any requirement including low-loss and or low-stress dielectrics. Both families of PVD are represented at the PNF, where processes cover both Electron Beam Evaporation and Sputtering with a range of options for specialized equipment relating to both.

AJA ATC 2200 UHV Sputtering System: The AJA ATC 2200 Sputtering System is a PVD tool which deposits films on a substrate by a method known as sputtering. Magnetron sputtering uses accelerated, positively charged ions from a plasma source to deposit films with an increased deposition rate and more controlled electron bombardment than evident in other sputtering systems (such as diode sputtering).

AJA ATC Orion 8 UHV Sputtering System: The AJA ATC Orion 8 UVH Sputtering System is a PVD tool which deposits films on a substrate using magnetron sputtering. Magnetron sputtering uses accelerated, positively charged ions from a plasma source to deposit films with an increased deposition rate and more controlled election bombardment than evident in other sputtering systems (such as diode sputtering).

Angstrom EvoVac Electron Beam Evaporator: The Angstrom EvoVac Electron Beam Evaporator is a PVD tool which evaporates high melting point materials, such as refractory metals and ceramics, using an electron beam. The EvoVac provides multiple sources of flexibility in its deposition system including resistive thermal evaporation, ion assisted and sputter deposition, as well as principal electron beam evaporation.

Angstrom Nexdep Thermal E-Beam Evaporator: The Angstrom Nexdep Thermal E-Beam Evaporator is a PVD tool that offers E-Beam and Thermal evaporation for a variety of high melting point substrates. The NexDep can be configured for a variety of PVD processes including resistive thermal evaporation, sputter and ion assisted deposition, and principal E-Beam and Thermal evaporation capacities.

Plassys Electron Beam Evaporator: The Plassys Electron Beam Evaporator MEB550S is a state of the art tool for Electron Beam Evaporation, a speciality PVD process here at the PNF where electron beam processes are used in highly specialized nanofabrication to meet the diverse needs of PNF based researchers, students, and clients (see Angstrom EvoVac Electron Beam Evaporator and Angstrom NexDep Thermal Electron Beam Evaporator). Electron beam evaporation is one of two broad families of PVD processes, the other being Sputtering. The PNF can accomodate users interested in either (see AJA ATC 2200 UHV Sputtering System and AJA ATC Orion 8 UHV Sputtering System).

Themal Evaporator: This is a cool thermal evap